IDS Software Suite 4.96.1
Using the example of the UI-388xLE, the specifications for maximum temperatures, mounting, shield and ESD protection are provided. The listed data is applicable for all uEye LE USB 3.1 Gen 1 board level versions.
Temperature management
Fig. 337: Temperature information
Assembly information
The uEye LE USB 3.1 Gen 1 camera can only be assembled from back to front.
Fig. 338: Mounting details
Assembly hole attachment
Fig. 339: Assembly hole attachment
ESD protection
•For optimum ESD protection, keep a clearance on all sides of 4 mm from unshielded housings. A smaller clearance is possible with shielded housings.
•The PCB should be mounted with the fixing screws on a base connected to the shield. If this is not possible, an insulating connection must be ensured.
•The connection cable should have a shield with low-resistance on both sides.
Fig. 340: ESD protection
